COM Express Type 2 (Basic and Compact Size Modules)

Express-SL2 (Basic Size Modules 125 mm x 95 mm)

- 6th Gen Intel Core, Intel Xeon and Intel Celeron Processors (formerly codename: Sky Lake-H)

- Dual channel DDR4 ECC/non-ECC memory in dual stacked SODIMM sockets

- Single/dual channel 18/24-bit LVDS and VGA

- Six PCIe x1, one PCI, one PCIe x16 (muxed with DDI channel)

- Three SATA, one PATA, eight USB 2.0 and GbE

- Extreme Rugged operating temperature: -40°C to +85°C

(selected SKUs)

Express-KL2 (Basic Size Modules 125 mm x 95 mm)

- Mobile 7th Gen Intel Xeon and Core Processors (formerly codename: Kaby Lake)

- Dual channel DDR4 ECC/non-ECC memory in dual stacked SODIMM sockets

- Single/dual channel 18/24-bit LVDS and VGA

- Six PCIe x1, one PCI, one PCIe x16 (muxed with DDI channel)

- Three SATA, one PATA, eight USB 2.0 and GbE

- Extreme Rugged operating temperature: -40°C to +85°C

(selected SKUs)

cExpress-BT2 ( Compact size: 95 mm x 95 mm )

- Single, dual, quad-core Intel Atom E3800 Series or Intel Celeron Processor SoC (formerly codename: Bay Trail)

- Up to 8GB Dual Channel DDR3L at 1333MHz

- VGA and dual channel 18/24-bit LVDS

- Two PCIe x1, and 32-bit PCI bus

- GbE, one SATA 3Gb/s, one PATA IDE, seven USB 2.0

- Supports Smart Embedded Management Agent (SEMA) functions

- Extreme Rugged operating temperature: -40C to +85C (build option)